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The Benefit and Challenge of Blockchain Technology for Tracing Automotive Component: a simulation test


Supply Chain Management System (SCMS) poses as
one of the essential aspects for distributing component, especially
in contemporary Automotive Industries. In this line, the tracing
process of the automotive part is one of the critical features
required in this industry, such as for automotive product
improvement and its forensic. Early research reported that the
tracing component feature is prone to component counterfeit that
could cause financial loss and even loss of life. The recent studies
emphasized that new development technology, commonly
renowned as Blockchain is believed to have the ability to perform
tracing automotive component and minimize the counterfeit.
However, the feature of Blockchain technology is to track
automotive component found in the literature mostly. In this
frame, the biggest challenge is to obtain the evidence of
Blockchain Technology implementation for automotive part
component tracking. Therefore, this report paper is a part of
design science research stages striving to perform the simulation
test by using business process simulation method of Blockchain
implementation for tracing automotive components. The focus
group discussion involved a manufacturer automotive
component, several distributors of automotive components, and
two of the big three car manufacturers in the country. The
purpose is to understand a comprehensive supply chain
management process in the area of automotive component
distribution. During the test by using simulation test model,
revealed several advantages and challenges. Ultimately,
Blockchain technology is potentially implemented for tracing
automotive component and the merging combination system
between SCMS and Blockchain Technology that contributes to
developing new robust SCMS.
Surjandy - Personal Name
Meyliana - Personal Name
Harco Leslie Hendric Spits Warnars - Personal Name
Edi Abdurachman - Personal Name
2277-3878
NONE
electronic file
English
Blue Eyes Intelligence Engineering & Sciences Publication
2019
INDIA
Vol. 8, Jil.8, Terbitan 4, Hlm. 5064-5068
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